Resin-sealed semiconductor device.

摘要

The resin-sealed semiconductor device of the present invention is characterized by a thin cured silicone film formed in such a way that it integratedly covers a surface of a semiconductor chip together with surfaces of bonding pads but does not substantially cover the bonding wires. This contributes to an improvement in the moisture resistance of the resin-sealed semiconductor device, while preventing bonding wire breaking caused by stress set up upon infliction of thermal shock to eliminate the adverse effect of stress on a semiconductor chip.