Bonding sheet for electronic component and method of bonding electronic component using the same.

摘要

The bonding sheet (20) of the present invention comprises a substrate having an opening (22), and a low-melting point bonding metal (25) which closes the opening (22) or is arranged on the peripheral portion of the opening, to project in the opening. According to a bonding sheet (20) of the present invention, a low-melting point bonding metal (25) is interposed between a conductor pattern of a substrate (30) and electrode terminals (42) of an electronic component (40), and is bonded by thermocompression at a low temperature without melting the low-melting point bonding metal, so that bonding of a large number of electrode terminals can be completed by a single bonding operation.