| 摘要 |
<p>The invention relates to a maleimide-diamine resin composition which is well soluble in a low boiling point solvent and has excellent heat resistance. The composition is characterized by containing a maleimide-diamine adduct having the general formula …<CHEM>… wherein A is a mono-, di-, tri- or tetravalent organic group containing at least two carbon atoms, R1 through R6 are a hydrogen atom, a lower alkyl group, a lower alkoxy group, a chlorine atom, bromine atom, trifluoromethyl group, or trichloromethyl group, and m is an integer of 0 to 4.</p> |
