| 摘要 |
<p>PURPOSE:To enable a semiconductor device to be used with several types of packages without changing the order of arrangement of bonding pads while avoiding complication in use, by providing auxiliary bonding pads in continuation with pad columns and rows at the corners positioned at the ends of the pad columns and rows. CONSTITUTION:At the corners 8a-8d defined by the ends of pad columns 5 and pad rows 7, there are provided auxiliary bonding pads 9 in continuation with the pad columns 5 and auxiliary bonding pads 10 in continuation with the pad rows 7. Bonding pads 4 and 6 located at the ends of the pad columns and rows are connected to the auxiliary bonding pads 10 and 9, respectively. According to this arrangement, a number of bonding pads to be provided in continuation with the pad columns and rows can be changed in accordance with various applications. Therefore, it can be used easily with various types of packages having different numbers of bonding for inner leads arranged in columns and rows.</p> |
