| 发明名称 |
Method for manufacture of printed circuit boards |
| 摘要 |
A method of preparing printed circuit boards is described in which the solder mask is applied over a thin layer of copper oxide covering the copper circuit traces, the copper oxide layer being that which remains after stripping the tin or tin-lead allow etch resist.
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| 申请公布号 |
US4732649(A) |
申请公布日期 |
1988.03.22 |
| 申请号 |
US19860875640 |
申请日期 |
1986.06.18 |
| 申请人 |
MACDERMID, INCORPORATED |
发明人 |
LARSON, GARY B.;WILLIAMS, ANN S.;LETIZE, RAYMOND A. |
| 分类号 |
H05K3/28;H05K3/06;H05K3/10;H05K3/24;H05K3/34;H05K3/38;H05K3/42;(IPC1-7):C23F1/00;B44C1/22;C03C15/00 |
主分类号 |
H05K3/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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