| 摘要 |
PURPOSE:To obtain an interlayer insulation film having improved flatness and improved characteristics well applicable to practical use, by providing a required number of projected layers between interconnection conductor layers on the reference plane on which an interconnection structure is to be provided, while the projected layers have a height similar to that of the interconnection conductor layers. CONSTITUTION:When varnish is used for an interlayer insulation film, the flatness of the resulting organic interlayer film becomes more improved, the smaller is a distance between interconnection conductor layers provided on the reference plane such as a substrate or the like on which an interconnection structure is to be provided. If the distance between the interconnection conductor layers provided on the reference plane is too large, a required number of projected layers having a thickness similar to that of the interconnection layers are provided therebetween. As a result, the distance between the portions projected from the reference plane including the interconnection conductor layers is decreased. An organic interlayer film having an improved flatness can be obtained in this manner. |
