| 摘要 |
PURPOSE:To reduce power, consumption by connecting a bonding pad for chang ing over internal operation to an internal circuit through an inverter while mounting a transistor for clamping, a control terminal of which is connected at an inverter output point. CONSTITUTION:A bonding pad PAD changing over the operation of an internal circuit (not shown) by the presence of bonding with an external terminal (not shown) is connected to an input point N1 for a CMOS inverter consisting of FETs Q1, Q2 and a drain in an PET QCn for clamping. When the PAD is floated, Q2 is turned OFF, and an output point N2 for the inverter reaches a high level, thus turning the QCn ON, then firmly clamping the N1. When the PAD is bonded with VCC, the QCn is turned OFF, and the flowing of useless currents can be prevented. |
