| 摘要 |
This card comprises contacts (8) and is composed of several plastic material layers (1,2;11,12,13,14) which are compatible. The core (1,2) comprises at least one local hard block (2) presenting a void (3). Two protecting layers (13,14) of lower thickness than the core cover the two upper and lower faces. A film (6) comprising a printed circuit the outputs of which are connected to a solid state circuit (7) comprising a microprocessor and/or at least one electronic memory is located between the core (1,2) and one of the protecting layers (13,14) at the location of the local hard block (2). The solid state circuit (7) is located at least partially in a void (3) of this hard block (2). The terminals of the printed circuit are connected through conductors (9) to contacts (8) of the card, these conductors being also located between the core (1,2) and the protecting layer (13).
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