| 摘要 |
PURPOSE:To facilitate the setting the control of welding conditions and to improve the fitting quality by performing a laser welding on an iron terminal the other end part after laser-welding one part of a lead frame to the soldered chip on a ceramic substrate in the case of fitting the lead frame. CONSTITUTION:In case of fitting to a ceramic substrate 3 the lower end part 4b of a lead frame 4, the chip 1 for welding is fitted to a fixed position of the ceramic substrate 3. The welding is then performed by projecting a laser light 8 in the state of overlapping the lower end part 4b of the lead frame 4 by abutting it onto the chip 1. It is thus joined via the chip 1 at the fixed position of the ceramic substrate 3. At this time, the chip 1 is provided with a soldering layer by presolder or plating in advance and with the pressing of a heating electrode or Joule heat by electrification a solder 2 is melted and joined to the ceramic substrate 3. The upper end part 4a of the lead frame 4 is then subjected to a laser welding to the iron terminal 5 provided on the upper part inner wall of a case 6 after arranging the ceramic substrate 3 in the case 6. |
