发明名称 SURFACE-TREATMENT OF PATTERNED COPPER FOIL OF COPPER COVERED LAMINATE
摘要 PURPOSE:To obtain a copper covered laminate having superior electrical characteristics by oxidizing the surface of copper foil so as to protect the surface from moisture, contaminants, sprayed brine, etc. CONSTITUTION:A treating soln. contg. about 30g/l NaClO2, about 5-10g/l NaOH and about 5-10g/l Na3PO4 is prepd. and kept at about 90-95 deg.C. A copper covered laminate having a copper foil circuit pattern on the insulating substrate is immersed in the treating soln. for about 2-5min to uniformly form a copper oxide film of CuO or Cu2O on the surface of the copper foil. Unlike a coated plastic film the copper oxide film has a nearly uniform thickness, so a copper covered laminate whose electrical characteristics such as dielectric loss tangent, dielectric constant and loss are stable is obtd. Since the copper oxide film is chemically stable, it is effective in preventing the chemical deterioration of the surface of the copper foil.
申请公布号 JPS6362884(A) 申请公布日期 1988.03.19
申请号 JP19860208419 申请日期 1986.09.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJITA IWAO
分类号 C23C22/63;H05K3/28 主分类号 C23C22/63
代理机构 代理人
主权项
地址