| 摘要 |
PURPOSE:To make it possible to change the positions of pads on a chip, by providing at least one spare pad in an integrated circuit chip having a plurality of bonding pads for inputting and outputting signals, and wiring the spare pad. CONSTITUTION:Bonding pads 10-12 and 14 are interconnected to circuit block 2-5, which are located to the right of the pads with wires 15. A pad 13 is a spare pad. When the wire 15, which is connected to the pad 12, is connected to the Pad 13, the position of the pad can be changed from the pad 12 to the pad 13. When the pads 10 and 11 are sequentially changed, the total of the three pad positions can be deviated. When the pad 13 is connected to the pad 14, the substantial position of the pad 14 can be moved to the pad 13 and the pad 14 can be used. |
