摘要 |
<p>A circuit board (17) is provided with anisotropic conductive adhesive (13). Projection electrodes (14) provided on a semiconductor device (16) are positioned to wiring patterns (15) on the circuit board (17). The semiconductor device (16) is mounted on the circuit board (17). The semiconductor device (16) is preliminarily attached to the circuit board (17) by a thermocompression tool (18) at lower temperature than the hardening temperature of the adhesive resin (11) of the anisotropic conducting adhesive (13). The semiconductor device (16) is finally bonded to the circuit board (17) by heating the adhesive resin (11) at its hardening temperature.</p> |