| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treating apparatus for effectively using treatment solution, while suppressing the deterioration of the quality of the treatment solution. SOLUTION: An etching pot 5 is filled with an etching solution, and a wafer 4 is supported by the bottom part in a state in which the outer peripheral part is sealed, and the face to be treated of the wafer 4 is brought into contact with the etching solution. One part of the etching solution after the surface treatment of which is carried out in a sub-pot 40 is mixed with new etching solution, and recovery treatment is carried out. One part of the etching solution after the surface treatment of which is carried out in the etching pot 5 is transferred through a communicating tube 60 to the sub-pot 40, and the etching solution after the recovery treatment is operated in the sub-pot 40 is transferred through the communicating tube 60 to the etching pot 5.
|
