| 摘要 |
PURPOSE:To prevent lead wirings from being deformed by forming a trapezoidal projection lower than a meshlike partition wall on the bottom of a recess for containing a semiconductor device, and forming a recess to be engaged with the sealing sheath of the device on the rear surface of a bottom plate. CONSTITUTION:A conveyor for a semiconductor device is formed with many recesses 3 surrounded by a meshlike partition wall 2 projected in a meshlike state from a bottom plate 1, a trapezoidal projection 8 lower than the wall 2 is formed in the bottom of the recess, and a recess 9 is formed at a position corresponding to the forming position of the projection 8 on the rear side of the bottom plate. Semiconductor integrated circuits are stacked in multiple stages, but engaged within the recess 9 formed on the rear surface of the conveyor disposed in an upper stage at part of a sealing sheath of a semiconductor integrated circuit 4, and contained in the relationship to be supported by the projection 8 formed in the bottom of the recess 3 disposed in a lower stage. Accordingly, lead wirings are correctly disposed in a hollow part to prevent the wirings from being deformed. |
