| 摘要 |
PROBLEM TO BE SOLVED: To efficiently prevent adhesion of processing liquid on the backside of a semiconductor wafer or the like by enabling adequate adjustment of gas flow rate for the processing liquid, such as developing liquid. SOLUTION: The flow rate of gas flowing between the backside of a semiconductor wafer 10, and a disc 14 is adjusted with a height-adjusting mechanism 19 for adjusting the height of a nozzle support material 15 and a disc 14. When a distance D between the disc 14 and semiconductor wafer 10 is reduced, four height-adjusting screws 21 are tightened equally to lift the disc 14 after loosening a fixing screw 22. Thereafter, when the distance D is increased, the four height- adjusting screws 21 are loosened equally, after loosening the fixing screw 22 to move downward the disc 14. After that, the fixing screw 22 is tightened. Thereby, the distance D is adjusted properly.
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