| 摘要 |
PURPOSE:To effectively inspect the soldering part of a mounting part, by inclining a specimen stand having a circuit part to be inspected mounted thereon and making the characteristic distribution of X-rays allowed to irradiate variable to detect transmitted X-rays. CONSTITUTION:A specimen 3 to be inspected such as an electronic circuit module is mounted on a specimen stage 4 and an electron beam target 10 is controlled by a voltage control apparatus 9 to control the acceleration voltage of the beam from an X-ray source 1. Further, the positions and angles theta1, theta2 of inclination of the specimen stage 4 in X- and Y-direction are controlled by a stage control apparatus 5. The X-rays transmitted through the specimen 3 to be inspected are detected by an X-ray detector 2 and a fluoroscopic image is stored in image memories 7a-7n. At this time, the generation voltage of X-rays allowed to irradiate is changed and the density value between fluoroscopic images to each metal material of solder is changed to extract the image only of a solder connection part by a computer 8. Since the image of the solder connection part is extracted from the fluoroscopic images in which the images corresponding to a plurality of metal materials constituting the circuit module are present in a mixed state, the internal flaw of the solder connection part can be detected with high reliability. |
