| 摘要 |
<p>A dual-inline-package semiconductor laser (1) package incorporating a temperature controlling Peltier element (8) and housed in a box shape metal case (9) having a window glass (10) includes: the metal case having a window glass which is hermetically sealed in a side wall portion thereof; a substrate (7) fixed on the Peltier element which is fixed in the metal case; a semiconductor laser fixed on the substrate through a chip carrier (3); a first lens (6), a light-detecting element (4), and a thermister (5) fixed on the substrate; a second lens (13) supported by a holder (12); an optical fiber (14), a portion near the distal end of which is protected by a metal sleeve (15); and a slide ring (16) having an inner diameter slightly larger than an outer diameter of the metal sleeve. A side wall around the window glass of the case is bonded to the holder, the holder is bonded to the slide ring, and the slide ring is bonded to the metal sleeve.</p> |
