发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To keep the height of a wire loop constant by turning a body of revolution, with which a bonding wire is brought into contact. in the direction that the body of revolution is pulled to the side reverse to a joining point by electromagnetic induction action in a tension imparting mechanism and controlling revolution or the basis of the arithmetic result of tesile force. CONSTITUTION:The coordinates of the joining point A of a semiconductor chip 17 and the coordinates of a joining point A' on a lead frame 18 are read from a storage medium such as a memory, a diskette or the like in which bonding information 26 is stored, and the length of a bonding wire electrically connecting both points is computed by an arithmetic circuit 27. Tensile force in which the sum of tensile force applied to the bonding wire 14 is equalized to the sum of tensile force data 28 at the time of the length of a reference wire, compared with the reference-wire length data 28 is acquired. The direction of rotation and rotational speed of a motor are controlled so that the bonding wire 14 is given tensile force obtained toward the joining point A' on the lead frame 18 from the joining point A. Accordingly, the fixed height of a wire loop can be kept.
申请公布号 JPS6360539(A) 申请公布日期 1988.03.16
申请号 JP19860203765 申请日期 1986.09.01
申请人 TOSHIBA CORP 发明人 NAGASAWA MASATO
分类号 H01L21/60 主分类号 H01L21/60
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