| 摘要 |
An electrically conducting hot melt adhesive is located at limited contact regions of a flexible circuit support, which typically carries a large scale integrated circuit (LSI) chip. A non-conducting hot melt adhesive is disposed between the limited contact regions at the non-contact regions. The resulting electrical connector can then be brought into contact with the corresponding areas of flexible or rigid circuit supports and through the application of heat and pressure, fuse the respective members so as to establish circuit paths between their limited contact regions via the electrically conducting hot melt adhesive. Heat and pressure are applied to the conducting hot melt adhesive in the same way as for an electrically non-conducting hot melt adhesive after contacting limited contact regions of another flexible circuit support or a rigid circuit support with the molten adhesive. Subsequently, the molten adhesive is left to cool so as to solidify. This results in establishing circuit paths between both the limited contact regions adhesively via the electrically conducting hot melt adhesive.
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