| 摘要 |
In a thermal head according to the present invention, a rod-like member having a circular cross-section is mounted on a support member. An array of heating elements is provided on the rod-like member. Drive signal side electrodes and driving power source side electrodes are connected to each heating element. The drive signal side electrodes are connected to a driver integrated circuit (IC). The driving power source side electrodes are connected in common at ends thereof to provide a common electrode. The common electrode extends along the outer circumferential surface of the rod-like member, is exposed on the side of the driver IC along the surface of the rod-like member opposing the support member, and is connected to a driving power source pattern on the side of the driver IC. A thermistor for detecting a temperature is provided in the vicinity of the rod-like member.
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