发明名称 |
METHOD FOR MEASURING LEVEL OF WAFER |
摘要 |
PURPOSE: A method for measuring a level of a wafer is provided to prevent a processing error due to a shot region smaller than a level measuring region by preparing a variation of the shot region. CONSTITUTION: A wafer level measuring system is formed with a light emitting portion and a light receiving portion. The light emitting portion radiates measuring light to a measuring region(42) of a wafer(W) in order to measure a level of the wafer(W). The light receiving portion receives the light reflected from the measuring region(42). A size of the measuring region(42) is increased or reduced by varying a mutual position between the light emitting portion and the light receiving portion. The measuring region(42) is measured within the inside of a shot region(40). Namely, the size of the shot region(40) is larger than the size of the measuring region(42).
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申请公布号 |
KR20020085030(A) |
申请公布日期 |
2002.11.16 |
申请号 |
KR20010024249 |
申请日期 |
2001.05.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, GEUN BOK |
分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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