发明名称 METHOD FOR MEASURING LEVEL OF WAFER
摘要 PURPOSE: A method for measuring a level of a wafer is provided to prevent a processing error due to a shot region smaller than a level measuring region by preparing a variation of the shot region. CONSTITUTION: A wafer level measuring system is formed with a light emitting portion and a light receiving portion. The light emitting portion radiates measuring light to a measuring region(42) of a wafer(W) in order to measure a level of the wafer(W). The light receiving portion receives the light reflected from the measuring region(42). A size of the measuring region(42) is increased or reduced by varying a mutual position between the light emitting portion and the light receiving portion. The measuring region(42) is measured within the inside of a shot region(40). Namely, the size of the shot region(40) is larger than the size of the measuring region(42).
申请公布号 KR20020085030(A) 申请公布日期 2002.11.16
申请号 KR20010024249 申请日期 2001.05.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, GEUN BOK
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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