| 摘要 |
<p>PURPOSE:To obtain the titled curable silicone composition of addition reaction type suitable as a coating agent in electrical and electronic fields, showing improved curing properties even in the presence of adhesive, by blending a polyorganosiloxane with a specific amount of a specified amine compound or silicon-containing amine compound. CONSTITUTION:(A) A polyorganosiloxane which contains an alkenyl group (e.g. vinyl group) bonded to silicon atom in the molecule and >=90mol% methyl group based on organic group except the alkenyl group bonded to silicon atom is blended with (B) a polyorganosiloxane which contains hydrogen atom bonded to silicon atom in the molecule and >=90mol% methyl group based on organic group bonded to silicon atom in such a way that the number of hydrogen atom bonded to silicon is 0.1-10 based on 1 alkenyl group bonded to silicon of the component A and the blend is mixed with (C) 0.01-500ppm curing catalyst and (D) 0.001-10pts.wt. based on 100pts.wt. total amounts of the components A and B of a compound shown by the formula [X is (substituted) monofunctional hydrocarbon, etc.; n is 0-5; R<1> is 1-10C alkyl; R<2> is 1-10C alkyl, etc.].</p> |
