| 摘要 |
A copper-nickel-tin-titanium-alloy suitable for use as a base material for semiconductors includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, and 0.12 to 1.5% titanium, the remainder being copper and common impurities. An alternative form of the inventive alloy includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, 0.12 to 1.5% titanium, and 0.05 to 0.45% chrome, the remainder being copper and common impurities. A method for making these alloys includes the steps of homogenizing the alloy at temperatures of 850 DEG to 950 DEG C. between 1 and 24 hours, hot-rolling the alloy at temperatures of 600 DEG to 800 DEG C. in one or more passes, and cooling the alloy to room temperature with a cooling speed of between 10 DEG C. per minute and 2000 DEG C. per minute. |
