| 摘要 |
PURPOSE:To improve the mechanical strength by baking the piezoelectric boards to be stacked with a conductive paste thereby to integrate them. CONSTITUTION:On piezoelectric boards 1 which are made by baking ceramic sheets and thereafter lapping the surfaces threof, an electrode paste is printed to form internal electrodes 2. The piezoelectric boards are dried and stacked so that patterns 11 appear in the same position on every other board. The stack is baked in an oxygen atmosphere while being applied with a load. Then, when an electroless nickel plating is applied to the integrated stack, metal projections 3(4) are formed in the edge of every other internal electrode on each of the opposing surfaces of the stack. Then, a board 13 is placed on the metal projections 3(4), and a resin is made to flow thereunder, dried and har dened to form an insulating coating layer 5. A conductive paste is printed over the insulating coating layer 5 thereby to form external electrodes 6(7). As to a terminal strip, a silver paste is baked to the piezoelectric board 14, the exter nal electrodes 6(7) are connected thereto, and an external lead wire 8 is soldered to the portion 15 to which the silver has been baked. With this, the mechanical strength can be enhanced and the cost can be reduced.
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