发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To prevent a resin-sealed package from cracking by forming the outer peripheral edge of a tab of a pellet mount resin-sealed in the package in a raised bent surface. CONSTITUTION:The outer peripheral edge of a tab 8 so disposed as to oppose inner leads 4 of an electronic device 1 having a resin-sealed package 14 is formed in a raised bent surface 10. For example, the outer peripheral edge of a lead frame 1 formed by punching and the outer peripheral edge of inner leads 4 group are melted or etched to form curved surfaces 10, 11. Thus, since it can prevent a stress generated in the package due to thermal stress from being concentrated at the outer peripheral edge of the tab, it can prevent the package from cracking at the corner as a starting point.
申请公布号 JPS6354759(A) 申请公布日期 1988.03.09
申请号 JP19860197185 申请日期 1986.08.25
申请人 HITACHI MICRO COMPUT ENG LTD;HITACHI LTD 发明人 SAKURAI SHUICHI;YUGAWA KOICHI;IINO MIKIO
分类号 H01L23/50;H01L23/28 主分类号 H01L23/50
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