| 摘要 |
PURPOSE:To shorten a bonding wire thereby to prevent a wire from being contacted by forming a recess on a resin substrate and mounting a semiconductor pellet in the bottom of the recess. CONSTITUTION:A recess 2 is formed on a pellet mounting substrate 1 made of resin, and a semiconductor pellet 3 is mounted in the bottom of the recess 2. For example, the surface of the substrate 1 made of glass epoxy resin substrate is cut to form the recess 2, waterproof substance is impregnated to the substrate near the inner wall of the recess 2 to form a waterproof layer 9, and the pellet 3 is mounted through an adhesive 4 of silver paste in the bottom of the recess 2. A wiring layer 5 of Cu is formed on the substrate 1 around the recess 2, and the layer 5 is electrically connected through a wire 6 of Au. Further, a frame 7 made of resin is bonded to the substrate 1, and epoxy resin 8 is filled in a space defined by the substrate 1 and the frame 7. |
