METHOD OF PACKAGING INTEGRATED CIRCUIT CHIP,申请号JP19860199234-传众专利搜索

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发明名称	METHOD OF PACKAGING INTEGRATED CIRCUIT CHIP
摘要
申请公布号	JPS6354737(A)	申请公布日期	1988.03.09
申请号	JP19860199234	申请日期	1986.08.25
申请人	NEC CORP	发明人	OGAWA FUMIHIRO
分类号	H01L21/52;H01L21/60	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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