发明名称 MOLDING OF DIACETYLENE GROUP-CONTAINING 1,3-SUBSTITUTED AROMATIC POLYAMIDE
摘要 PURPOSE:To obtain the title molding having a high modulus of elasticity and being excellent in heat resistance, strength and moldability, by molding a specified diacetylene group-containing 1,3-substituted aromatic polyamide. CONSTITUTION:An amine (a) of formula I (wherein X and X' are each H, a 1-20C hydrocarbyl or a carbonyl, sulfonyl, or the like bonded to this group and R and R' are each a 1-20C bivalent aromatic hydrocarbon group bonded in positions 1 and 3 to the amide group and the diacetylene group, respectively) is dissolved in an aqueous alkali solution, and the formed solution is mixed with a water-insoluble organic solvent solution of 0.1-2 equivalent of a carboxylic acid halide of formula II (wherein A is a halogen and Z is a 1-20C bivalent hydrocarbol group), a carboxylic ester of formula III (wherein B is a hydrocarbyl group) or a carboxylic acid of formula IV. The mixed solution is reacted at -20-300 deg.C for 20min-10hr to obtain a diacetylene group- containing 1,3-substituted aromatic polyamide having repeating units of formula V (degree of polymerization >=2). This polyamide is molded into a molding having any desired shape and a modulus of elasticity >=6 GPa.
申请公布号 JPS6354431(A) 申请公布日期 1988.03.08
申请号 JP19860198051 申请日期 1986.08.26
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 KATO JINICHIRO;NAKAMURA KATSUYUKI
分类号 C08F299/02;B29C43/02;B29C43/56;B29K77/00;C07C233/00;C08F290/00;C08G69/26;C08G69/32;C08G69/42 主分类号 C08F299/02
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