发明名称 |
MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT |
摘要 |
<p>MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.</p> |
申请公布号 |
CA1233910(A) |
申请公布日期 |
1988.03.08 |
申请号 |
CA19850487257 |
申请日期 |
1985.07.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
YAMAMOTO, TSUYOSHI;OKADA, NOBUHIDE;KAWAMURA, YASUO |
分类号 |
H05K3/30;H05K3/34;H05K1/02 |
主分类号 |
H05K3/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|