发明名称 MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT
摘要 <p>MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.</p>
申请公布号 CA1233910(A) 申请公布日期 1988.03.08
申请号 CA19850487257 申请日期 1985.07.22
申请人 FUJITSU LIMITED 发明人 YAMAMOTO, TSUYOSHI;OKADA, NOBUHIDE;KAWAMURA, YASUO
分类号 H05K3/30;H05K3/34;H05K1/02 主分类号 H05K3/30
代理机构 代理人
主权项
地址