发明名称 |
INTEGRATED CIRCUIT PACKAGE (1111111) |
摘要 |
An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks. |
申请公布号 |
EP0137385(B1) |
申请公布日期 |
1988.03.02 |
申请号 |
EP19840111297 |
申请日期 |
1984.09.21 |
申请人 |
HITACHI, LTD. |
发明人 |
OGIHARA, SATORU;KODAMA, HIRONORI;USHIFUSA, NOBUYUKI;OTSUKA, KANJI |
分类号 |
H01L23/36;H01L23/02;H01L23/057;H01L23/367;H01L23/373 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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