PROCESS FOR PRODUCING MULTILAYER CERAMIC CIRCUIT BOARD WITH COPPER

摘要

A process for producing a multilayer ceramic circuit board with copper including the steps of: forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO2-B2O3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.