| 摘要 |
PURPOSE:To prevent the warpage of a semiconductor element with liable to occur joining, and to obviate further warpage after resin seal by cementing the semiconductor element with a joining section having a small area required approximately separated from a non-joining section in a placing member while forming a through-hole to the non-joining section. CONSTITUTION:A semiconductor element 1 is connected to a non-joining section 5b by connecting sections 5c in an area smaller than its own size at the central section of a lower surface, and united with a joining section 5a in a placing member 5 approximately separated from the non-joining section 5b by a joining material 6, and a joining area between the element 1 and the member 5 is relatively kept constant at all times, thus preventing the generation of the warpage of the element 1 with joining. On the other hand, a large number of through-holes 5d are shaped to the non-joining section 5b in the member 5, a sealing resin 2 intrudes into the holes 5d, and adhesion is increased while bonding is strengthened by the entanglement of the resin 2 in the holes 5d, thus also obviating the generation of warpage, after sealing. |
