Modular interconnect block with protector structure

摘要

A distribution frame comprising interconnect block modules for use in telecommunications is disclosed. The frame is front accessible for both wiring and test access. The structure incorporates a reversible wire guide to facilitate wiring of a module from either the right or left hand side of a particular mounting bracket. The individual modules incorporate an overload protector element which utilizes a printed circuit board as a primary contact structure. The individual modules also use split cylinder insulation displacement connectors which are readily accessible from the front of the module and terminate in spring fingers which make contact to the overload protector elements.