| 摘要 |
A mask and solder form for mounting of multi-leaded integrated circuit carriers to printed wiring boards during a soldering process is disclosed. The form comprises a multi-layer composite frame-like structure. The top layer is a translucent sheet, and is provided with a solder and flux strip. The top layer is bonded to a divider layer which is slotted to accept the multi-wire leads of the circuit carrier. The bottom surface of the divider layer is coated with adhesive. The transparent top layer permits precise alignment of the leads of the carrier and the printed wiring board lines. The divider layer blocks the flow of molten solder between leads by providing each wire with its own individual slot. The form is well suited to production loading of the circuit carriers on the printed wiring boards for vapor phase soldering.
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