| 摘要 |
In order to provide a structure which is not susceptible to the so called "peel-off" phenomenon which tends to occur with arrangements wherein electroluminescent layers are arranged one over the top of each other in discrete overlapping layers, and to avoid the use of yeild reducing etchants which readily attack the electroluminescent material through the inevitable pin holes and cracks which appear in the insulating layers covering the elements during the production of the panel, the light emitting elements are formed in side by side or non-overlapping relationships via a lift off technique. This obviates both the peel-off phenomenon and use of corrosive etchants.
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