| 发明名称 |
Multi-wafer slicing with a fixed abrasive |
| 摘要 |
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
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| 申请公布号 |
US4727852(A) |
申请公布日期 |
1988.03.01 |
| 申请号 |
US19850762493 |
申请日期 |
1985.08.05 |
| 申请人 |
CRYSTAL SYSTEMS INC. |
发明人 |
SCHMID, FREDERICK;KHATTAK, CHANDRA P.;SMITH, MAYNARD B. |
| 分类号 |
B23D57/00;B28D5/00;B28D5/04;(IPC1-7):B28D1/02 |
主分类号 |
B23D57/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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