| 摘要 |
PURPOSE:To form a photosensitive heat-resistant resin composition which need not be baked at high temperature after being formed into a pattern and can give a pattern of excellent heat resistance, by using a component having a specified polyimide resin skeleton. CONSTITUTION:This photosensitive heat-resistant resin composition contains a polyimide resin skeleton of formula I as a component. In formula I, R1 is at least one bivalent group selected from among those of formulas II, III, IV and V, R2 is at least one tetravalent group selected from those of formulas VI and VII, R3, R4, R5 and R6 are each at least one monovalent group selected from among H, an aromatic group and an alkyl group and (n) is an integer >=1. Said composition may be entirely composed of components having a polyim ide resin skeleton of formula I or may be composed of its mixture with other resins. In order to control the photosensitivity of this composition, it is possible to add, optionally, at least either of a photosensitizer or a photopolymerization initiator thereto. |
