摘要 |
The socket is foreseen for fastening and connecting an electronic component with lined-up conducting pins, whereby the free end of the pins is parallel to the main plane of the component, as it is the case for the SMD components. The socket comprises a carrier of insulating material and contact elements maintained in the carrier and positioned each with its first flexible end in the face of a pin for applying a determined contact pressure on that pin when the component is mounted in the socket. The second end of the contact element can be soldered to a conductor in a circuit. The socket comprises further a comb of insulating material with teeth gliding in a guidance of the carrier. Before the insertion of the component into the socket, the teeth of the comb are placed between the contact elements; after the insertion of the component into the socket and an adequate displacement of the comb, each tooth is in the face of a contact element and applies a pressure to the corresponding pin of the mounted component against the contact element.
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