| 摘要 |
PURPOSE:To obtain the title firm wiring board wherein the electric conductor is stably adhered to the ceramic by etching the nitride ceramic board to rough the surface, heating the board, and then forming a metal layer by metallizing. CONSTITUTION:The surface of the sintered nitride ceramic board is etched and roughed. The board is then washed with water, dried, and heated, and the surface is activated. The board is then chemically plated with Cu, Ni, etc., and electrolytically plated, as necessary. The electric circuit is further formed by etching, as required. A minute pattern by metallic conductors can be formed by this method without damaging the fundamental characteristic of the ceramic. Moreover, the adhesion between the metal layer and the ceramic board is uniformized and stabilized, and a firm nitride wiring board can be obtained. |
