发明名称 DEVICE FOR REGENERATING CHEMICAL COPPER PLATING SOLUTION
摘要 PURPOSE:To prevent the deposition of copper on a membrane surface and to improve the efficiency in removing accumulated ions by arranging a metallic mesh close to an anion-exchange resin membrane, providing a standard electrode and a counter electrode to keep the potential of the metallic mesh at an appropriate value, and further furnishing an oxygen bubbling means. CONSTITUTION:The metallic mesh 5 is provided over the whole surface of the anion- exchange resin membrane 20a in a plating soln. regeneration chamber 40 close to the membrane, and the standard electrode 6 and the counter electrode 7 are arranged in opposition to each other. The standard electrode 6 and the counter electrode 7 are connected to a DC power source 8 through a lead wire 9 and impressed with a potential negative to the metallic mesh 5. The exhausted chemical copper plating soln. 13 is charged in a regeneration chamber 40, and a DC voltage is impressed between electrodes 1 and 2. Besides, a voltage controlled to make the potential difference between the metallic mesh 5 and the standard electrode 6 constant is impressed between the metallic mesh 5 and the counter electrode 7 by a DC power source 8, and regeneration is carried out. At this time, air is sent to an air bubbling pipeline 60, and bubbled over the whole surface of the anion-exchange resin membrane 20a to prevent the deposition of copper.
申请公布号 JPS6347372(A) 申请公布日期 1988.02.29
申请号 JP19860191334 申请日期 1986.08.15
申请人 NEC CORP 发明人 OTA HIROTOKU
分类号 C23C18/16;C23C18/40 主分类号 C23C18/16
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