发明名称 Chip module for surface mounted device - with ceramic or ferrite plate for conductive turns representing LC oscillator circuit
摘要 Chip module for use as a surface mounted device (SMD) is a cubical insulator body of ceramic or ferrite plates with grooves filled with conductive material to form coils of defined inductance. The chip represents an LC-oscillator circuit, the inductance being determined by the geometry of the coil turns, and the capacitance by the dielectric constant, loss angle and insulation resistance of the ceramic plates. ADVANTAGE - This produces chip modules for use as oscillator circuits, bandpass filters or miniature transformers without need for an SMD casing.
申请公布号 DE3628021(A1) 申请公布日期 1988.02.25
申请号 DE19863628021 申请日期 1986.08.19
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 SCHLENK, WOLFGANG, DR. DIPL.-PHYS., 8520 ERLANGEN, DE;KIPPENBERG, HORST, DR. DIPL.-PHYS., 8522 HERZOGENAURACH, DE
分类号 H01F17/00;H01F17/04;(IPC1-7):H01F19/00;H01G4/40;H01F15/04;H01F15/10;H01F41/04;H01F41/10;H01G13/00;H01G4/30;H03H7/01;H03H7/12;H01F27/42 主分类号 H01F17/00
代理机构 代理人
主权项
地址