| 摘要 |
The invention relates to a method for soldering electrical circuit boards (2) having components which have been temporarily fitted in advance by plugging on or bonding onto these circuit boards, along a soldering line which includes at least one solder bath. The circuit boards are lifted into a trough, which is open at the top, over the edge of said trough, by means of gripping devices, the solder bath being located in the trough (8), enveloped by a protective-gas atmosphere. Each gripping device tows in each case one circuit board into the trough, over the solder wave, and after drag soldering, over the edge of the trough again, out of said trough, into a further processing region. The gripping arm is the preferred arm of a robot. <IMAGE>
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