| 摘要 |
PURPOSE:To solve the problem of non-wetting with solder in the spacings be tween chip parts etc., by providing a cylindrical body bored with many solder ejection ports freely turnably to the election port at the top end of a nozzle and turning the cylindrical body so as to move the projecting jet waves formed on the ejection holes. CONSTITUTION:A work (printed wiring board) W is fed by a conveyor for transportation along a conveyance path A provided to incline upward to a solder tank 11. The cylindrical body 51 bored uniformly with the many solder ejection ports 52 over the entire surface is freely turnably provided in the ejec tion port at the top end of the nozzle 29 of the solder tank 11. When the cylindri cal body 51 is turned, thc ejection holes 52 move accordingly; therefore, the projecting jct waves ejected from the holes 52 move as well. the flux gas accu mulating in the spacings between the chip parts adhered to the bottom surface of the work W is expelled by the movement of the projecting jet waves, by which the molten solder is surely intruded into said spacing and the non-wetting with the solder is prevented. |
