| 摘要 |
<p>In a method of fabricating a linear array of semiconductor chips 18 such as LED's, solder is placed at selected locations on a substrate 10, semiconductor chips 18 are placed upon the solder and then the wider is melted, then cooled. As the solder melts, the semiconductor chips will align themselves due to surface tension and, upon solidifying of the solder, the chips will be secured to the substrate at the selected locations. A wetting agent may be placed at the selected locations, and a solder migration inhibitor at other locations. The selected locations may comprise depressions on the substrate. <IMAGE></p> |
