| 摘要 |
PURPOSE:To suppress the oxidation of solder generated in a nozzle part by constituting a titled device in such a manner that the head of the jet solder ejected from the nozzle can be easily adjusted by an opening and closing adjustment plate in the returning stage of said jet solder to a solder tank. CONSTITUTION:The molten solder S force-fed in the solder tank 11 jets from the nozzle 29 and a work W above the nozzle 29 is soldered by the jet solder S. The jet solder S falls thereafter into a receiving box 52 and is returned through a discharge port 57 of the box 52 into the solder tank 11. The aperture area of the discharge port 57 is so adjusted by the opening and closing adjustment plate 61 that the solder levels 64, 65 in the receiving box are positioned upper than the solder level 51 in the tank; therefore, the head of the jet solder S falling from the nozzle 29 decreases. Wavy disturbance and contact area with the atm. are thus decreased and the oxidation of the molten solder is suppressed. The aperture area of the discharge port 57 is easily adjustable by turning a screw 73 and moving the plate 61 upward and downward. |
