Wärmeleitende Verpackung von elektronischen Schaltungseinheiten

摘要

The invention relates to a heat-conducting coating of electronic circuit assemblies ( 102 ), comprising a coating agent ( 100 ), which encloses the electronic circuit assembly ( 102 ) and which is electrically insulating, with dispersed particles in the coating agent ( 100 ) which have a high thermal conductivity, whereby the particles dispersed in the coating agent ( 100 ) are embodied as nanoelements ( 101 ).