| 摘要 |
<p>PURPOSE:To prevent the contamination of a wafer by utilizing electrostatic force, by positively charging dust by ionizing venting gas by discharge while adhering floated dust by utilizing the electric field generated between the wafer and a grid. CONSTITUTION:In introducing gas into a process chamber 1 through a vent gas arranged pipe 2, said gas is ionized by the discharge of a discharge electrode 3 and the electron in the ionized gas is removed by a grid held to positive potential while the positively charged gas is introduced into the chamber 1. Floating dust is positively charged by the adhesion of the positive ion in the charged gas and attracted to a dust collecting grid 5 which is held to negative potential and has a sticky surface to be adhered to the surface of the grid 5. In this case, by applying positive potential to a wafer holder 6 and a wafer 7, buoyance to dust in generated. Therefore, purification can be performed during wafer processing.</p> |
