发明名称 |
Hölje för en optisk anordning samt förfarande för framställning av denna optiska anordning |
摘要 |
<p>The invention concerns a housing for an optical arrangement and a method for production of the optical arrangment. In the housing according to the invention, an essentially smooth surface is produced on connection flange 23 and the upper surface on a sapphire substrate 23 has a recess with sloping sides and the electrically conducting paste edges are arranged on the recess's sloping slides in which the edges of the paste are prevented from rising higher on the ends than in the other parts after firing. In the method according to the invention the optical chip set is connected on connection flange 23 so that electrode 65 and solder layer 66, each of which has a light introduction pole 24 are mounted in succession in the layer on the anchored side of the optical chip set, which is then anchored to connection flange 23 by means of solder layer 66. <IMAGE></p> |
申请公布号 |
FI880867(A) |
申请公布日期 |
1988.02.24 |
申请号 |
FI19880000867 |
申请日期 |
1988.02.24 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIZAWA, HIDEAKI |
分类号 |
H01L33/48;H01L31/02;H01L31/0203;H01L31/18;(IPC1-7):H01L/ |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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