发明名称 |
Isolation material for layers in intergrated circuits with damascene archtitecture, comprising molecules having atoms at the surface only, like for example fullerenes |
摘要 |
<p>Insulating layer material for integrated circuits in damascene architecture contains or consists of molecules (I), with atoms only on the surface, that are separated from one another by other (groups of) molecules (II) having at least 2 positions bound by chemical and/or physical interactions with (I).</p> |
申请公布号 |
EP1420447(B1) |
申请公布日期 |
2009.03.18 |
申请号 |
EP20030104114 |
申请日期 |
2003.11.07 |
申请人 |
LEIBNIZ-INSTITUT FUER FESTKOERPER- UND WERKSTOFFFORSCHUNG DRESDEN E.V. |
发明人 |
HERMANN, HELMUT;TAESCHNER, CHRISTINE;ZSCHECH, EHRENFRIED |
分类号 |
H01L23/522;C08G61/02;H01L21/312;H01L21/314;H01L21/316;H01L21/768;H01L23/532 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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