| 摘要 |
<p>PURPOSE:To prevent intrusion of water through the interface between resin and a lead frame, by performing plating treatment of an outer lead between two times of resin sealing. CONSTITUTION:A semiconductor element 2 is mounted on an element mounting part 1 of a lead frame 10. A piece of wire 4 is bonded to the electrode of the semiconductor element 2 and the tip of a lead 3 of the lead frame 10. The element is sealed with a first resin 5. At this time, resin burr yielded on the resin 5 is not removed, but a plating film 6 of the outer lead of the lead frame is formed. The outside of the resin 5 is further sealed with a second resin 7 to form the outer configuration of a mold. At this time, the plating film 6 acts as a cushion member, and the resin burr yielded between the lead frame 10 and molds 8 and 9 is suppressed. Even if the resin burr is yielded, the burr is not required to be removed since the plating film 6 is formed. Thus, intrusion of water and ionic impurities can be prevented without impairing adhesion of the interface between the resins 5 and 7 and the lead frame.</p> |
